Through electrode substrate and semiconductor device

ABSTRACT

A through electrode substrate includes a substrate having a through hole extending through between a first face and a second face, a diameter of the through hole not having a minimum value inside the through hole; and a conductor arranged inside the through hole, wherein the through hole has a shape having a value obtained by summing a first to an eighth inclination angle at a first to an eighth position, respectively, of an inner face of the through hole of 8.0° or more, each of the first to the eighth inclination angle is an angle of the inner face with respect to a center axis of the through hole, and the first to the eighth position correspond to positions at distances of 6.25%, 18.75%, 31.25%, 43.75%, 56.25%, 68.75%, 81.25%, and 93.75%, respectively, from the first face in a section from the first face to the second face.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a U.S. continuation application filed under 35U.S.C. § 111(a), of International Application No. PCT/JP2017/029276,filed on Aug. 14, 2017, which claims priority to Japanese PatentApplication No. 2016-172606, filed on Sep. 5, 2016, the disclosures ofwhich are incorporated by reference.

FIELD

The present disclosure relates to a through electrode substrate.

BACKGROUND

In recent years, a three-dimensional mounting technique of stackingsemiconductor circuit substrates formed with integrated circuitsperpendicularly has been used. Such a mounting technique, a substrateformed with a through electrode has been used. Such a substrate may bealso called interposer. The through electrode is formed by arranging aconductor in a through hole formed in the substrate. In order to achievehigh integration, fining of the through hole is required. For example,in PTL 1 (International Publication WO2010/087483), and PTL 2 (JapanesePatent Application Publication No. 2014-501686), a technique ofirradiating a glass substrate with a laser beam is disclosed in order toform a fine through hole.

SUMMARY

According to one embodiment of the present disclosure, a throughelectrode substrate includes a substrate having a first face and asecond face, the substrate having a through hole extending throughbetween the first face and the second face, a diameter of the throughhole not having a minimum value inside the through hole; and a conductorarranged inside the through hole, wherein the through hole has a shapehaving a value obtained by summing a first inclination angle to aneighth inclination angle at a first position to an eighth position,respectively, of an inner face of the through hole of 8.0° or more, eachof the first inclination angle to the eighth inclination angle is anangle of the inner face with respect to a center axis of the throughhole, and an angle expanding toward the first face is defined as apositive, and the first position to the eighth position correspond topositions at distances of 6.25%, 18.75%, 31.25%, 43.75%, 56.25%, 68.75%,81.25%, and 93.75%, respectively, from the first face in a section fromthe first face to the second face.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a view illustrating a cross-sectional structure of a throughelectrode substrate in a first embodiment of the present disclosure.

FIG. 2 is a view illustrating a manufacturing method for the throughelectrode substrate in the first embodiment of the present disclosure.

FIG. 3 is a view illustrating a manufacturing method for the throughelectrode substrate following FIG. 2 (formation of a through hole).

FIG. 4 is a view illustrating a manufacturing method for the throughelectrode substrate following FIG. 3 (formation of a first metal layer).

FIG. 5 is a view illustrating a manufacturing method for the throughelectrode substrate following FIG. 4 (formation of the first metallayer).

FIG. 6 is a view illustrating a manufacturing method (formation of asecond metal layer) of the through electrode substrate following FIG. 5.

FIG. 7 is a view illustrating a manufacturing method for the throughelectrode substrate following FIG. 6 (formation of the throughelectrode).

FIG. 8 is a view illustrating a manufacturing method for a throughelectrode substrate following FIG. 7 (formation of a wiring layer).

FIG. 9 is a view illustrating a shape example of the through hole (shapeA) in First Example of the present disclosure.

FIG. 10 is a view illustrating a shape example of the through hole(shape B) in Second Example of the present disclosure.

FIG. 11 is graphs illustrating shape properties of the through hole inFirst Example (shape A1) of the present disclosure.

FIG. 12 is graphs illustrating shape properties of the through hole inFirst Example (shape A2) of the present disclosure.

FIG. 13 is graphs illustrating shape properties of the through hole inFirst Example (shape A3) of the present disclosure.

FIG. 14 is graphs illustrating shape properties of the through hole inFirst Comparative Example (shape A4) of the present disclosure.

FIG. 15 is graphs illustrating shape properties of the through hole inFirst Comparative Example (shape A5) of the present disclosure.

FIG. 16 is graphs illustrating shape properties of the through hole inSecond Example (shape B1) of the present disclosure.

FIG. 17 is graphs illustrating shape properties of the through hole inSecond Example (shape B2) of the present disclosure.

FIG. 18 is a view illustrating shape properties of the through hole inSecond Comparative Example (shape B3) of the present disclosure.

FIG. 19 is graphs illustrating shape properties of the through hole inSecond Comparative Example (shape B4) of the present disclosure.

FIG. 20 is a view illustrating a shape example (shape C) of the throughhole in Third Example of the present disclosure.

FIG. 21 is a view illustrating a shape example (shape D) of the throughhole in Fourth Example of the present disclosure.

FIG. 22 is a view illustrating a shape example (shape E) of the throughhole in Fifth Example of the present disclosure.

FIG. 23 is graphs illustrating shape properties of the through hole inThird Example (shape C1) of the present disclosure.

FIG. 24 is graphs illustrating shape properties of the through hole inThird Example (shape C2) of the present disclosure.

FIG. 25 is graphs illustrating shape properties of the through hole inThird Example (shape C3) of the present disclosure.

FIG. 26 is graphs illustrating shape properties of the through hole inThird Comparative Example (shape C4) of the present disclosure.

FIG. 27 is graphs illustrating shape properties of the through hole inFourth Example (shape D1) of the present disclosure.

FIG. 28 is graphs illustrating shape properties of the through hole inFourth Example (shape D2) of the present disclosure.

FIG. 29 is graphs illustrating shape properties of the through hole inFourth Comparative Example (shape D3) of the present disclosure.

FIG. 30 is a view illustrating shape properties of the through hole inFourth Comparative Example (shape D4) of the present disclosure.

FIG. 31 is graphs illustrating shape properties of the through hole inFifth Example (shape E1) of the present disclosure.

FIG. 32 is a view showing a semiconductor device according to a secondembodiment of the present disclosure.

FIG. 33 is a view showing another example of the semiconductor deviceaccording to the second embodiment of the present disclosure.

FIG. 34 is a view showing still another example of the semiconductordevice according to the second embodiment of the present disclosure.

FIG. 35 is a view illustrating electronic equipment including thesemiconductor device according to the second embodiment of the presentdisclosure.

DESCRIPTION OF EMBODIMENTS

Through electrode substrates according to respective embodiments of thepresent disclosure are described in detail below with reference to thedrawings. It is to be noted that each embodiment shown below is anexample of an embodiment of the present disclosure, and the presentdisclosure should not be interpreted as being limited to theseembodiments. It is to be noted that, in the drawings referred to in thepresent embodiment, the same portion or a portion having a similarfunction is denoted by the same reference sign or similar sign (anumerical sign only followed by A, B, C, or the like) and repeateddescription thereof may be omitted. In addition, a size ratio in thedrawings may be different from an actual ratio, or a portion of aconfiguration may be omitted from the drawings for the convenience ofdescription.

First Embodiment [Configuration of Through Electrode Substrate]

FIG. 1 is a view illustrating a cross-sectional structure of a throughelectrode substrate according to a first embodiment of the presentdisclosure. A through electrode substrate 10 includes a glass substrate100 and wiring layers 210, 220. The wiring layer 210 is arranged on afirst face 101 side of the glass substrate 100. The wiring layer 220 isarranged on a second face 102 side of the glass substrate 100. The glasssubstrate 100 is provided with through holes 150 extending through fromthe first face 101 to the second face 102. A through electrode 50 is aconductor arranged inside the through hole 150 and a portion of theglass substrate 100 on the first face 101 side and a portion thereof onthe second face 102 side. The through electrode 50 electrically connectsthe first face 101 side and the second face 102 side of the glasssubstrate 100. The wiring layer 210 includes a conduction layer 212 andan insulation layer 215. The wiring layer 220 includes a conductionlayer 222 and an insulation layer 225. The conduction layer 212 and theconduction layer 222 are electrically connected to each other throughthe through electrode 50. It is to be noted that at least one or both ofthe wiring layer 210 and wiring layer 220 may not be present.

In FIG. 1, a shape of the through hole 150 appears to be a cylindricalshape, but actually an inner face of the through hole 150 has acomplicated shape. This also applies to illustrations of FIGS. 2 to 8.It is to be noted that, regarding a specific shape of the through hole150, shapes shown in FIGS. 9, 10, 22, 23, 24 described later areexemplified.

[Method for Manufacturing Through Electrode Substrate]

Subsequently, a manufacturing method for the through electrode substrate10 is described with reference to FIG. 2 to FIG. 8. First of all, a stepof forming the through hole 150 in the glass substrate 100 is described.

FIG. 2 is a view illustrating a manufacturing method for a throughelectrode substrate according to the first embodiment of the presentdisclosure. FIG. 3 is a view illustrating a manufacturing method for thethrough electrode substrate following FIG. 2 (formation of a throughhole). The glass substrate 100 is first prepared (FIG. 2). A thicknessof the glass substrate 100 is 400 μm in this example. Instead of theglass substrate 100, a substrate formed from another inorganic material,such as a quartz substrate, a silicon wafer, or a ceramic, may be used,or a substrate formed from an organic material, such as a resinsubstrate, may be used. When a substrate having conductivity, such as asilicon wafer, is used, a substrate surface including the inner face ofthe through hole is covered with an insulator in order to prevent thethrough electrode and the substrate from being electrically continuouswith each other with the through hole formed therein.

Subsequently, the through hole 150 is formed in the glass substrate 100(FIG. 3). The through hole 150 is formed such that the inner facethereof has any one of the shapes shown in FIGS. 9, 10, 20, 21, 22, asdescribed above. In this example, the shape of the through hole 150satisfies either one of first conditions and second conditions describedbelow.

(First Conditions)

The first conditions include conditions shown in the following items (1)and (2).

(1) A diameter Sd does not have a minimum value inside the through hole150.

(2) A value (a total value) obtained by summing inclination angles at aplurality of measurement points in the inner face of the through hole150 is 8.0° or more.

Here, the plurality of measurement points correspond to positions atdistances of 6.25%, 18.75%, 31.25%, 43.75%, 56.25%, 68.75%, 81.25%, and93.75% from the first face 101 in a section from the first face 101 tothe second face 102 (eight points in total: from a first position to aneighth position).

(Second Conditions)

The second conditions include conditions shown in the following items(3), (4), (5).

(3) The diameter Sd has a minimum value inside the through hole 150.

(4) A value obtained by summing inclination angles at a plurality offirst measurement points in the inner face of the through hole 150 (afirst total value) is 4.0° or more.

(5) A value obtained by summing inclination angles at a plurality ofsecond measurement points in the inner face of the through hole 150 (asecond total value) is −4.0° or less.

Here, the plurality of first measurement points correspond to positionsat distances of 6.25%, 18.75%, 31.25%, and 43.75% from the first face101 in a section from the first face 101 to the second face 102 (fourpoints in total: from the first position to the fourth position). Theplurality of second measurement points correspond to positions atdistances of 56.25%, 68.75%, 81.25%, and 93.75% from the first face 101in a section from the first face 101 to the second face 102 (four pointsin total: from the fifth position to the eighth position).

Definitions of the respective terms described above are described. Theinside of the through hole 150 refers to between the first face 101 andthe second face 102 of the glass substrate 100 in the through hole 150.The diameter Sd of the through hole 150 refers to a distance from acenter axis of the through hole 150 to the inner face in across-sectional shape perpendicular to the center axis. The diameter Sdvaries according to a position of the section perpendicular to thecenter axis. In this example, the cross-sectional shape is circular.Therefore, the diameter Sd corresponds to a radius. Further, the centeraxis is located at a center of the circle. In addition, in this example,the center axis of the through hole 150 is perpendicular to the firstface 101 and the second face 102. The inclination angle is aninclination angle of the inner face with respect to the center axis ofthe through hole 150. The inclination angle at which the first face 101side expands takes a positive value.

The through hole 150 satisfying the first conditions is formed byirradiating the glass substrate 100 with a laser light under apredetermined condition. The through hole 150 satisfying the secondcondition is formed by performing an etching process using predeterminedetching liquid after irradiating the glass substrate 100 with a laserlight under the predetermined condition. The maximum value of thediameter Sd approximately ranges from 35 μm to 45 μm. As describedabove, the thickness of the glass substrate 100 is 400 μm. Therefore, anaspect ratio (a ratio of a length of the through hole 150 (the thicknessof the glass substrate 100) to a diameter of the through hole 150 (amaximal value of the diameter Sd×2)) is about 5. It is desired that theabove-described first conditions or second conditions are applied to thethrough hole 150 having the aspect ratio of 4 or more. Regarding thethrough hole 150 satisfying either the first conditions or the secondconditions, a detailed processing condition thereof is described in eachexample described later.

Subsequently, a step of forming the through electrode 50 in the throughhole 150 is described.

FIG. 4 is a view illustrating a manufacturing method (formation of afirst metal layer) for the through electrode substrate following FIG. 3.FIG. 5 is a view illustrating a manufacturing method for the throughelectrode substrate following FIG. 4 (formation of the first metallayer). FIG. 6 is a view illustrating a manufacturing method for thethrough electrode substrate following FIG. 5 (formation of a secondmetal layer). FIG. 7 is a view illustrating a manufacturing method forthe through electrode substrate following FIG. 6 (formation of thethrough electrode).

A first metal layer 51 is formed on the glass substrate 100 formed withthe through hole 150. The first metal layer 51 has a function of a seedlayer for an electroplating process. The first metal layer 51 is madefrom Ti. It is to be noted that the first metal layer 51 may be madefrom a metal functioning as a seed layer for the electroplating process,and may be made from, for example, a metal containing Cu, Ni, Cr, Ti, orW, or the like.

The first metal layer 51 is first formed by a sputtering technique onthe first face 101 side of the glass substrate 100 (FIG. 4). In thisexample, the first metal layer 51 is deposited by the sputteringtechnique on the first face 101 side while the glass substrate 100 isbeing rotated. A rotation axis of the glass substrate 100 is inclined toa normal line of the first face 101. It is desired that an inclinationangle of the rotation axis be equal to or more than 0° and equal to orless than 20°, and it is 10° in this example. It is to be noted that anormal line of a surface of a target used in sputtering is parallel withthis rotation axis.

At this point of time, the first metal layer 51 has been formed on thefirst face 101 side, but has not been formed on the second face 102side. Further, the first metal layer 51 has been formed on a portion onthe first face 101 side of the inner face of the through hole 150, buthas not been formed on a portion on the second face 102 side. Therefore,the first metal layer 51 is deposited by the sputtering technique fromthe second face 102 side of the glass substrate 100 (FIG. 5). By thisprocess, the surface of the glass substrate 100 is covered with thefirst metal layer 51. It is desired that the first metal layer 51 isdeposited on the first face 101 (and the second face 102) so as to havea thickness of equal to or more than 0.1 μm and equal to or less than 3μm, and the first metal layer 51 is deposited so as to have a thicknessof 1.5 μm. The first metal layer 51 deposited on the inner face of thethrough hole 150 becomes thinner than the first metal layer 51 depositedon the first face 101.

Subsequently, a second metal layer 52 is grown by an electroplatingprocess using the first metal layer 51 as a seed layer. A mask made ofan insulator such as a resist is formed in a region where the secondmetal layer 52 is not to be grown, prior to the electroplating process.The mask is removed after the second metal layer 52 has been grown (FIG.6). Thereby, since the second metal layer 52 does not grow in theportion where the mask has been formed, the first metal layer 51 isexposed in a region from which the mask is removed.

The second metal layer 52 is made from Cu. It is to be noted that thesecond metal layer 52 may be made from a metal containing Au, Ag, Pt,Al, Ni, Cr, Sn, or the like. In this example, the second metal layer 52is formed so as to have a film thickness which does not fill the insideof the through hole 150. A space within the through hole 150 formed bythe inside being not filled may contain gas, may be filled with aninsulator such as a resin, or may be filled with a conductor such asanother metal. It is to be noted that the second metal layer 52 may alsobe formed so as to have a film thickness which fills the inside of thethrough hole 150.

Subsequently, the first metal layer 51 exposed is etched using thesecond metal layer 52 as a mask, and then the through electrode 50 isformed (FIG. 7). It is to be noted that the through electrode 50 has astacked structure composed of the first metal layer 51 and the secondmetal layer 52, but this stacked structure is collectively illustratedin each figure without being distinguished to respective layers.

As the aspect ratio of the through hole 150 increases, the first metallayer 51 may not be formed on a portion of the inner face of the throughhole 150. When a region where the first metal layer 51 is not formed ispresent, a region where the second metal layer 52 is not formed occursin an electroplating process at the next step. As a result, a failure toachieve electrical continuity between the first face 101 side and thesecond face 102 side occurs.

On the other hand, when the shape of the through hole 150 satisfies thefirst conditions and the second conditions described above, the firstmetal layer 51 is formed approximately over the entire inner face of thethrough hole 150. Thereby, since the second metal layer 52 becomes hardto separate inside the through hole 150, the through electrode 50achieving electrical continuity between the first face 101 side and thesecond face 102 side can be formed.

FIG. 8 is a view illustrating a manufacturing method for the throughelectrode substrate following FIG. 7 (formation of a wiring layer). Oncethe through electrode 50 is formed in the glass substrate 100, a wiringlayer 210 is then formed on the first face 101 side of the glasssubstrate 100. The wiring layer 210 is obtained, for example, by formingan insulation layer 215 having a contact hole and forming a conductionlayer 212. The insulation layer 215 is formed, for example, from aphotosensitive dry film resist. The contact hole is formed by forming adry film resist on the glass substrate 100, exposing the same in apredetermined pattern, and developing the same. The conduction layer 212may be formed by using an electroplating process or may be formed byvapor deposition using a sputtering technique or the like, in the samemanner as the through electrode 50 described above. By forming theinsulation layer 215 and the conduction layer 212 repeatedly, the wiringlayer 210 having a multilayer structure is formed.

Subsequently, a wiring layer 220 is formed on the second face 102 sideof the glass substrate 100, and thereby a structure shown in FIG. 1 isobtained. The manufacturing method for the through electrode substrate10 is as described above.

EXAMPLE

[Shape of Through Hole (without Minimum Value of Diameter Sd)

The shape of the through hole 150 and a manufacturing method forachieving this shape are described. First of all, a shape having thediameter Sd not having a minimum value inside the through hole 150 isdescribed. Here, First Example (shape A) and Second Example (shape B)are described.

FIG. 9 is a view illustrating a shape example (shape A) of a throughhole in First Example of the present disclosure. The diameter Sd of athrough hole 150A shown in FIG. 9 is the largest size on the first face101 side, becomes smaller toward the second face 102 side, and is thesmallest size on the second face 102 side. It is to be noted that, inFIG. 9, a center axis CA of the through hole 150A corresponds to acenter of a circle appearing when the through hole 150A is cut along aplane parallel to the first face 101. Therefore, a distance from thecenter axis CA to the inner face of the through hole 150A (a radius ofthe circle) corresponds to the diameter Sd. Further, an inclinationangle TA is an angle of the inner face to the center axis CA. In FIG. 9,an angle between an inclination SS of the inner face at 175 μm (43.75%)from the first face 101 and the center axis CA is exemplified as theinclination angle TA.

FIG. 10 is a view illustrating the shape example (shape B) of a throughhole in Second Example of the present disclosure. The diameter Sd of athrough hole 150B shown in FIG. 10 is smaller on the first face 101 sidethan on the second face 102 side, and becomes larger once from the firstface 101 side toward the second face 102 side and then becomes smaller.That is, the diameter Sd has a maximum value inside the through hole. Aposition where the diameter Sd reaches the maximum value is present on aside nearer to the first face 101 side of a middle position between thefirst face 101 and the second face 102.

The through holes having the shape A and the shape B were produced by anapparatus for performing laser irradiation disclosed in theabove-described PTL 1 (International Publication WO 2010/087483). Inirradiation with an excimer laser light, irradiation fluence at a faceto be processed of the glass substrate 100 was adjusted for each 50 μm.By adjusting the irradiation fluence in this manner, the shape of thethrough hole to be formed was controlled.

First Example and First Comparative Example

Regarding various shapes of the through hole 150A assuming the shape A,influence on forming the first metal layer 51 was evaluated. Here,through holes having shapes A1 to A3 were formed as First Example.Further, through holes having shapes A4, A5 were formed as FirstComparative Example. A relationship between a depth Fd and theirradiation fluence (the number of shots) in each shape is as shown inthe following Table 1. It is to be noted that the depth Fd correspondsto a distance from the first face 101. Therefore, the depth Fd=0 μmcorresponds to the first face 101, and the depth Fd=400 μm correspondsto the second face 102.

TABLE 1 Irradiation Condition of Laser Light (shape A) Depth FdIrradiation Fluence (J/cm2), The number of Shots (times) (μm) A1 A2 A3A4 A5  0-50  9.3, 537 8.6, 583 8.9, 559 8.9, 559 8.6, 583  50-100 10.0,499 10.7, 465  8.9, 559 8.9, 559 8.6, 583 100-150 11.5, 436 9.3, 5378.6, 583 8.6, 583 8.6, 583 150-200 12.9, 388 9.3, 537 8.6, 583 8.2, 6088.6, 583 200-250 10.0, 499 8.6, 583 8.6, 583 8.2, 608 7.9, 636 250-300 9.3, 537 7.9, 636 8.6, 583 8.2, 608 8.2, 608 300-350  8.6, 583 7.9, 6368.2, 608 8.2, 608 8.2, 608 350-400  9.3, 537 7.9, 636 8.2, 608 7.9, 6367.9, 636

FIG. 11 is graphs illustrating shape properties of the through hole inFirst Example (shape A1) of the present disclosure. FIG. 12 is graphsillustrating shape properties of the through hole in First Example(shape A2) of the present disclosure. FIG. 13 is graphs illustratingshape properties of the through hole in First Example (shape A3) of thepresent disclosure. FIG. 14 is a view illustrating shape properties ofthe through hole in First Comparative Example (shape A4) of the presentdisclosure. FIG. 15 is a view illustrating shape properties of thethrough hole in First Comparative Example (shape A5) of the presentdisclosure. The shape properties of the through holes shown in FIG. 11to FIG. 15 include a relationship between the depth Fd and the diameterSd and a relationship between the depth Fd and the inclination angle TA.It is to be noted that measurement positions of the inclination anglesTA are positions at distances of 6.25% (25 μm), 18.75% (75 μm), 31.25%(125 μm), 43.75% (175 μm), 56.25% (225 μm), 68.75% (275 μm), 81.25% (325μm), and 93.75% (375 μm) from the first face 101 in a section from thefirst face 101 to the second face 102 (eight points in total).

In the through holes 150A having the shapes A1 to A5, the throughelectrodes 50 were formed by the method described in the above-describedfirst embodiment. A cross-section of the through electrode 50 havingeach shape was observed, and whether or not the first metal layer 51 wasformed over the entire inner face of the through hole 150A wasevaluated. It was judged to be good (OK) if a region where the firstmetal layer 51 was not formed was absent, while it was judged to be notgood (NG) if a region where the first metal layer 51 was not formed waspresent. It is to be noted that, since the first metal layer was verythin, whether or not the first metal layer 51 was formed was evaluatedindirectly by forming the second metal layer 52 by the electroplatingprocess and observing a situation of the second metal layer 52.

As a result, it was judged that the shapes A1, A2, A3 were good, whilethe shapes A4, A5 were not good.

[Second Example and Second Comparative Example]

Regarding various shapes of the through hole 150B assuming the shape B,influence on forming the first metal layer 51 was evaluated. Here,through holes having shapes B1, B2 were formed as Second Example.Further, through holes having shapes B3, B4 were formed as SecondComparative Example. A relationship between the depth Fd and theirradiation fluence (the number of shots) in each shape is as shown inthe following Table 2.

TABLE 2 Irradiation Condition of Laser Light (shape B) Depth FdIrradiation Fluence (J/cm2), The number of Shots (times) (μm) B1 B2 B3B4  0-50  3.5, 1414  4.3, 1176  2.1, 2363  2.8, 1771  50-100  2.8, 1771 4.3, 1176  3.5, 1414  2.1, 2363 100-150  9.3, 537  9.3, 537  9.3, 537 6.4, 780 150-200 10.0, 499 10.0, 499 10.0, 499 10.0, 499 200-250 11.5,436 10.7, 465 10.7, 465 10.7, 465 250-300 11.5, 436 10.0, 499 10.0, 49910.0, 499 300-350 11.5, 436 10.0, 499 10.0, 499 10.0, 499 350-400 11.5,436  9.3, 537  7.1, 701  9.3, 537

FIG. 16 is graphs illustrating shape properties of the through hole inSecond Example (shape B1) of the present disclosure. FIG. 17 is graphsillustrating shape properties of the through hole in Second Example(shape B2) of the present disclosure. FIG. 18 is graphs illustratingshape properties of the through hole in Second Comparative Example(shape B3) of the present disclosure. FIG. 19 is graphs illustratingshape properties of the through hole in Second Comparative Example(shape B4) of the present disclosure. The shape properties of thethrough hole shown in FIG. 16 to FIG. 19 include a relationship betweenthe depth Fd and the diameter Sd and a relationship between the depth Fdand the inclination angle TA. In the evaluation method, whether or notthe first metal layer 51 was formed over the entire inner face of thethrough hole 150B was evaluated in the same manner as described above.

As a result, it was judged that the shapes B1, B2 were good, while theshapes B3, B4 were not good.

[Relationship Between Evaluation Result and Inclination Angle (withoutMinimum Value of Diameter Sd)]

From the evaluation results obtained from First Example, FirstComparative Example, Second Example, and Second Comparative Exampledescribed above, it was found that when a total value TSA of theinclination angle TA satisfied a predetermined condition, a goodevaluation result could be obtained. The inclination angle total valueTSA is a value obtained by summing the inclination angles TA at theeight points. A relationship between the inclination angle total valueTSA and the evaluation result with respect to each shape is shown in thefollowing Table 3.

TABLE 3 Inclination Angle Total Value TSA and Evaluation Result withrespect to Each Shape Inclination Angle Shape Total Value TSA (°)Evaluation Result A1 29.23 Good A2 11.71 Good A3 9.38 Good A4 7.03 NotGood A5 5.86 Not Good B1 14.07 Good B2 8.22 Good B3 0.09 Not Good B4−2.24 Not Good

As shown in Table 3, when the inclination angle total value TSA at theeight measurement points is 8° or more, the evaluation result is good.This shows that the above-described through hole 150 has a shapesatisfying the “first conditions”.

[Shape of Through Hole (with Minimum Value of Diameter Sd)

A shape in which the diameter Sd has a minimum value inside the throughhole 150 is described. Here, Third Example (shape C), Fourth Example(shape D), and Fifth Example (shape E) are described.

FIG. 20 is a view illustrating a shape example (shape C) of a throughhole in Third Example of the present disclosure. The diameter Sd of athrough hole 150C shown in FIG. 20 is the largest on the first face 101side and the second face 102 side, and has a minimum value in thevicinity of a middle inside the through hole. The vicinity of the middleis a position of the depth Fd between 43.75% (175 μm) and 56.25% (225μm), and is a position of about 50% (200 μm).

FIG. 21 is a view illustrating a shape example (shape D) of a throughhole in Fourth Example of the present disclosure. The diameter Sd of athrough hole 150D shown in FIG. 21 has a minimum value in the vicinityof the middle inside the through hole, and has a maximum value at anintermediate position between the first face 101 and the vicinity of themiddle and at an intermediate position between the second face 102 andthe vicinity of the middle.

FIG. 22 is a view illustrating a shape example (shape E) of a throughhole in Fifth Example of the present disclosure. The diameter Sd of athrough hole 150E shown in FIG. 22 has a maximum value on the first face101 side and the second face 102 side, and has a minimum value at anintermediate position between the first face 101 and the vicinity of themiddle and at an intermediate position between the second face 102 andthe vicinity of the middle. It is to be noted that the diameter Sd hasthe maximum value in the vicinity of the middle, except for the diameterSd at the first face 101 and the diameter Sd at the second face 102.

The through holes having the shape C, the shape D and the shape E wereproduced by using an apparatus for performing laser irradiation and anetching apparatus disclosed in the above-described PTL 2 (JapanesePatent Application Publication No. 2014-501686). Specifically, a damageregion is formed inside the glass substrate 100 by performingirradiation with a UV laser beam using an Nd:KGW laser apparatusdescribed in the above-described literature. At this time, laser beamirradiation from the first face 101 side of the glass substrate 100 andlaser beam irradiation from the side of the second face 102 thereof weresequentially performed. Laser beam irradiation from each face wasperformed under the same conditions.

After laser beam irradiation from each of the faces was finished, thedamage region of the glass substrate 100 was dissolved by performing anetching process for 10 minutes within an ultrasonic bath using anetching solution (aqueous solution of HF (20 volume %)+HNO3 (10 volume%)) at 35° C.

The shape of the damage region to be formed on the glass substrate 100was adjusted by adjusting an irradiation condition of the laser beam inthe above-described process. When the shape of the damage region varies,the shape of the through hole also varies with the variation in theshape of the damage region. The irradiation condition includes an inletaperture diameter of the laser beam (an aperture diameter of a surfaceof the glass substrate 100), an intermediate aperture diameter (anaperture diameter in the vicinity of the middle of the glass substrate100 (200 μm from the surface), and an irradiation time. The inletaperture diameter and the intermediate aperture diameter are adjusted bychanging a lens NA and a focal position.

Third Example and Third Comparative Example

Regarding various shapes of the through hole 150C assuming the shape C,influence on forming the first metal layer 51 was evaluated. Here,through holes having shapes C1, C2, C3 were formed as Third Example.Further, a through hole having shape C4 was formed as Third ComparativeExample. The irradiation condition in each shape is as shown in thefollowing Table 4.

TABLE 4 Irradiation Condition of Laser Light (Shape C) C1 C2 C3 C4 InletAperture Diameter (μm) 75 75 75 75 Intermediate Aperture Diameter (μm)55 65 70 73 Irradiation Time (msec.) 25 25 25 25

FIG. 23 is graphs illustrating shape properties of a through hole inThird Example (shape C1) of the present disclosure. FIG. 24 is graphsillustrating shape properties of a through hole in Third Example (shapeC2) of the present disclosure. FIG. 25 is graphs illustrating shapeproperties of a through hole in Third Example (shape C3) of the presentdisclosure. FIG. 26 is graphs illustrating shape properties of a throughhole in Third Comparative Example (shape C4) of the present disclosure.The shape properties of the through hole shown in FIG. 23 to FIG. 26include a relationship between the depth Fd and the diameter Sd and arelationship between the depth Fd and the inclination angle TA. In theevaluation method, whether or not the first metal layer 51 was formedover the entire inner face of the through hole 150C was evaluated in thesame manner described above.

As a result, it was judged that the shapes C1, C2, C3 were good whilethe shape C4 was not good.

Fourth Example and Fourth Comparative Example

Regarding various shapes of the through hole 150D assuming the shape D,influence on forming the first metal layer 51 was evaluated. Here,through holes having shapes D1, D2 were formed as Fourth Example.Further, a through hole having shape D3, D4 were formed as FourthComparative Example. The irradiation condition in each shape is as shownin the following Table 5.

TABLE 5 Irradiation Condition of Laser Light (Shape D) D1 D2 D3 D4 InletAperture Diameter (μm) 58 58 53 50 Intermediate Aperture Diameter (μm)80 80 80 100 Irradiation Time (msec.) 15 18 20 22

FIG. 27 is graphs illustrating shape properties of a through hole inFourth Example (shape D1) of the present disclosure. FIG. 28 is graphsillustrating shape properties of a through hole in Fourth Example (shapeD2) of the present disclosure. FIG. 29 is graphs illustrating shapeproperties of a through hole in Fourth Comparative Example (shape D3) ofthe present disclosure. FIG. 30 is graphs illustrating shape propertiesof a through hole in Fourth Example (shape D4) of the presentdisclosure. The shape properties of the through hole shown in FIG. 27 toFIG. 30 include a relationship between the depth Fd and the diameter Sdand a relationship between the depth Fd and the inclination angle TA. Inthe evaluation method, whether or not the first metal layer 51 wasformed on the entire inner face of the through hole 150D was evaluatedin the same manner as described above.

It was judged that the shapes D1, D2 were good while the shapes D3, D4were not good.

Fifth Example

Regarding various shapes of the through hole 150E assuming the shape E,influence on forming the first metal layer 51 was evaluated. Here, athrough hole having a shape E1 was formed as Fifth Example. Theirradiation condition in this shape is as shown in the following Table6.

TABLE 6 Irradiation Condition of Laser Light (Shape E) E1 Inlet ApertureDiameter (μm) 75 Intermediate Aperture Diameter (μm) −75 IrradiationTime (msec.) 25

FIG. 31 is graphs illustrating shape properties of a through hole inFifth Example (shape E1) of the present disclosure. The shape propertiesof the through hole shown in FIG. 31 include a relationship between thedepth Fd and the diameter Sd and a relationship between the depth Fd andthe inclination angle TA. In the evaluation method, whether or not thefirst metal layer 51 was formed on the entire inner face of the throughhole 150E was evaluated in the same manner as described above.

As a result, it was judged that the shape E1 was good.

[Relationship Between Evaluation Result and Inclination Angle (withMinimum Value of Diameter Sd)]

From the evaluation results obtained from Third Example, ThirdComparative Example, Fourth Example, Fourth Comparative Example andFifth Example described above, it was found that when a total value TSAof the inclination angles TA satisfied a predetermined condition, a goodevaluation result could be obtained. The inclination angle total valueTSA is a total value obtained by summing the inclination angles TA atfour points. A relationship between the inclination angle total valueTSA and the evaluation result with respect to each shape is shown in thefollowing Table 7. Measurement positions of the inclination angles TAare positions at four points corresponding to distances of 6.25% (25μm), 18.75% (75 μm), 31.25% (125 μm), 43.75% (175 μm) from the firstface 101 in a section from the first face 101 to the second face 102.

It is to be noted that regarding the through holes having the shapes C,D, E, the first face 101 side and the second face 102 side is in asymmetrical relationship with respect to the middle (50%, 200 μm) of thethrough hole. Therefore, when the measurement positions of theinclination angles TA are positions at four points corresponding todistances of 56.25% (225 μm), 68.75% (275 μm), 81.25% (325 μm), and93.75% (375 μm) from the first face 101 in a section from the first face101 to the second face 102, the inclination angle total value TSAbecomes a value the plus or minus sign of which was reversed.

TABLE 7 Inclination Angle Total Value TSA and Evaluation Result withrespect to Each Shape Inclination Angle Shape Total Value TSA (°)Evaluation Result C1 23.31 Good C2 11.71 Good C3 4.10 Good C4 3.05 NotGood D1 9.11 Good D2 4.03 Good D3 −4.51 Not Good D4 −7.74 Not Good E15.73 Good

As shown in Table 7, when the inclination angle total value TSA at thefour measurement points (corresponding to distances of 6.25% (25 μm),18.75% (75 μm), 31.25% (125 μm), 43.75% (175 μm) from the first face 101in a section from the first face 101 to the second face 102) is 4° ormore, the evaluation result is good. At this time, eventually, when theinclination angle total value TSA at the four measurement points(corresponding to distances of 56.25% (225 μm), 68.75% (275 μm), 81.25%(325 μm), and 93.75% (375 μm) from the first face 101 in a section fromthe first face 101 to the second face 102) is −4° or less, theevaluation result is good. This shows that the above-described throughhole 150 has a shape satisfying the “second conditions”.

Second Embodiment

In a second embodiment, a semiconductor device manufactured using thethrough electrode substrate 10 in the first embodiment is described.

FIG. 32 is a view showing a semiconductor device according to the secondembodiment of the present disclosure. A semiconductor device 1000 hasthree through electrode substrates 10 (10-1, 10-2, 10-3) stacked, and isconnected to an LSI substrate 70. The through electrode substrate 10-1has, for example, a semiconductor element such as a DRAM, and hasconnection terminals 81-1, 82-1 formed of the conduction layers 212, 222and the like. These through electrode substrates 10 (10-1, 10-2, 10-3)may be manufactured by using the glass substrate 100, or some throughelectrode substrates 10 may be manufactured by using a substrate madefrom a material different from a material of the other through electrodesubstrates 10. The connection terminal 81-1 is connected to a connectionterminal 80 of the LSI substrate 70 via a bump 90-1. The connectionterminal 82-1 is connected to the connection terminal 81-2 of thethrough electrode substrate 10-2 via a bump 90-2. The connectionterminal 82-2 of the through electrode substrate 10-2 and the connectionterminal 83-1 of the through electrode terminal 10-3 are also connectedto each other via a bump 90-3. As the bumps 90 (90-1, 90-2, 90-3) suchmetal as, for example, indium, copper or gold or like is used.

It is to be noted that, when the through electrode substrates 10 arestacked, the number of layers is not limited to three, but it may be twolayers or furthermore may be four or more layers. Further, connection ofthe through electrode substrate 10 to another substrate is not limitedto the case where the connection is performed via the bump, but it maybe performed by using another bonding technique, such as eutecticbonding. In addition, the through electrode substrate 10 and anothersubstrate may be bonded together by applying polyimide, epoxy resin orthe like and baking the same.

FIG. 33 is a view showing another example of the semiconductor deviceaccording to the second embodiment of the present disclosure. Thesemiconductor device 1000 shown in FIG. 33 has a stacked structureobtained by stacking semiconductor circuit substrates (semiconductorchips) 71-1, 71-2, such as an MEMS device, a CPU, or a memory, and thethrough electrode substrate 10, and is connected to the LSI substrate70.

The through electrode substrate 10 is arranged between the semiconductorcircuit substrate 71-1 and the semiconductor circuit substrate 71-2, andis connected thereto via the bumps 90-1 and 90-2, respectively. Thesemiconductor circuit substrate 71-1 is mounted on the LSI substrate 70.The LSI substrate 70 and the semiconductor circuit substrate 71-2 areconnected to each other via wires 95. In this example, the throughelectrode substrate 10 is used as an interposer for three-dimensionalmounting by stacking a plurality of semiconductor circuit substrates.The through electrode substrate 10 is connected to a plurality ofsemiconductor circuit substrates each having different functions, sothat a multi-functional semiconductor device can be obtained. Forexample, by using the semiconductor circuit substrate 71-1 as athree-axis acceleration sensor and using the semiconductor circuitsubstrate 71-2 as a two-axis magnetic sensor, a semiconductor deviceproviding a five-axis motion sensor in one module can be obtained.

When a semiconductor circuit substrate is a senor made of an MEMSdevice, or the like, a sensing result may be outputted as an analogsignal. In this case, a low-pass filter, an amplifier, or the like, maybe formed in the semiconductor circuit substrate or the throughelectrode substrate 10.

FIG. 34 is a view showing another example of the semiconductor deviceaccording to the second embodiment of the present disclosure. The twoexamples (FIG. 32, FIG. 33) described above are the 3-dimensionalmounting, but this example is an example of application to2.5-demensional mounting. In the example shown in FIG. 34, six throughhole substrates 10 (10-1 to 10-6) are stacked and connected on the LSIsubstrate 70. However, all the through hole substrates 10 are not onlyarranged in a stacking manner but are also arranged side by side inin-plane direction of the substrates.

In the example shown in FIG. 34, the through electrode substrates 10-1,10-5 are connected on to the LSI substrate 70, the through electrodesubstrates 10-2, 10-4 are connected on to the through electrodesubstrate 10-1, the through electrode substrate 10-3 is connected on tothe through electrode substrate 10-2, and the through electrodesubstrate 10-6 is connected on to the through electrode substrate 10-5.It is to be noted that, also when the through electrode substrate 10 isused as an interposer for connecting a plurality of semiconductorcircuit substrates, like the example shown in FIG. 33, 2.5-demensionalmounting is applicable. For example, the through electrode substrate10-3, 10-4, 10-6, or the like, may be replaced with a semiconductorcircuit substrate.

The semiconductor device 1000 thus manufactured is mounted on variouskinds of electric equipment, for example, a mobile terminal (such as amobile phone, a smartphone and a laptop-type personal compute), aninformation processing device (a desktop-type personal computer, aserver, a car navigation system, or the like), a home electricalappliance, or the like.

FIG. 35 is a view showing electronic equipment including thesemiconductor device according to the second embodiment of the presentdisclosure. The semiconductor device 1000 is mounted on various kinds ofelectric equipment, for example, a mobile terminal (such as a mobilephone, a smartphone and a laptop-type personal computer), an informationprocessing device (a desktop-type personal computer, a server, a carnavigation system, or the like), a home electrical appliance, or thelike. As examples of the electrical equipment mounted with thesemiconductor device 1000, a smartphone 500 and a laptop-type personalcomputer 600 are shown. These pieces of electrical equipment have acontroller 1100 composed of a CPU or the like for executing anapplication program to achieve various functions. The various functionsinclude a function using an output signal from the semiconductor device1000. It is to be noted that the semiconductor device 1000 may have thefunction of the controller 1100.

What is claimed is:
 1. A through electrode substrate comprising: asubstrate having a first face and a second face, the substrate having athrough hole extending through between the first face and the secondface, a diameter of the through hole not having a minimum value insidethe through hole; and a conductor arranged inside the through hole,wherein the through hole has a shape having a value obtained by summinga first inclination angle to an eighth inclination angle at a firstposition to an eighth position, respectively, of an inner face of thethrough hole of 8.0° or more, each of the first inclination angle to theeighth inclination angle is an angle of the inner face with respect to acenter axis of the through hole, and an angle expanding toward the firstface is defined as a positive, and the first position to the eighthposition correspond to positions at distances of 6.25%, 18.75%, 31.25%,43.75%, 56.25%, 68.75%, 81.25%, and 93.75%, respectively, from the firstface in a section from the first face to the second face.
 2. The throughelectrode substrate according to claim 1, wherein the conductor includesa first metal layer and a second metal layer, the first metal layer isarranged between the second metal layer and the substrate, and the firstmetal layer is arranged at least a portion of both the first face andthe second face.
 3. The through electrode substrate according to claim2, wherein at least a portion of the first metal layer arranged in thefirst face and the second face is connected to the first metal layerarranged inside the through hole.
 4. The through electrode substrateaccording to claim 1, wherein the conductor is arranged along the innerface, and an insulation region surrounded by the conductor is arrangedinside the through hole.
 5. The through electrode substrate according toclaim 4, wherein the insulation region is a region filled with aninsulator.
 6. The through electrode substrate according to claim 5,wherein the insulator includes a resin.
 7. The through electrodesubstrate according to claim 1, wherein the substrate is a glasssubstrate.
 8. The through electrode substrate according to claim 1,wherein the conductor includes a first metal layer arranged on thesubstrate and a second metal layer arranged on the first metal layer. 9.The through electrode substrate according to claim 1, wherein an aspectratio of the through hole is 4 or more.
 10. A semiconductor devicecomprising: the through electrode substrate according to claim 1; and asemiconductor circuit substrate electrically connected to the conductorof the through electrode substrate.
 11. A through electrode substratecomprising: a substrate having a first face and a second face, thesubstrate having a through hole extending through between the first faceand the second face, a diameter of the through hole having a minimumvalue inside the through hole; and a conductor arranged inside thethrough hole, wherein the through hole has a shape having a valueobtained by summing a first inclination angle to a fourth inclinationangle at a first position to a fourth position, respectively, of aninner face of the through hole of 4.0° or more, and a value obtained bysumming a fifth inclination angle to an eight inclination angle at afifth position to an eighth position, respectively, of the inner face of−4.0° or less, each of the first inclination angle to the eighthinclination angle is an angle of the inner face with respect to a centeraxis of the through hole, and an angle expanding toward the first faceis defined as a positive, and the first position to the eighth positioncorrespond to positions at distances of 6.25%, 18.75%, 31.25%, 43.75%,56.25%, 68.75%, 81.25%, and 93.75%, respectively, from the first face ina section from the first face to the second face.
 12. The throughelectrode substrate according to claim 11, wherein the conductorincludes a first metal layer and a second metal layer, the first metallayer is arranged between the second metal layer and the substrate, andthe first metal layer is arranged at least a portion of both the firstface and the second face.
 13. The through electrode substrate accordingto claim 11, wherein at least portions of the first metal layer arrangedin the first face and the second face are connected to the first metallayer arranged inside the through hole.
 14. The through electrodesubstrate according to claim 11, wherein the conductor is arranged alongthe inner face, and an insulation region surrounded by the conductor isarranged inside the through hole.
 15. The through electrode substrateaccording to claim 14, wherein the insulation region is a region filledwith an insulator.
 16. The through electrode substrate according toclaim 15, wherein the insulator includes a resin.
 17. The throughelectrode substrate according to claim 11, wherein the substrate is aglass substrate.
 18. The through electrode substrate according to claim11, wherein the conductor includes a first metal layer arranged on thesubstrate and a second metal layer arranged on the first metal layer.19. The through electrode substrate according to claim 11, wherein anaspect ratio of the through hole is 4 or more.
 20. A semiconductordevice comprising through electrode substrate according to claim 11, anda semiconductor circuit substrate electrically connected to theconductor of the through electrode substrate.